New kit combines hardware and software to accelerate AI integration for defense, security, and industrial applications
Teledyne FLIR OEM
has launched the Boson®+ IQ Development Kit, a new solution designed to speed up the integration of thermal imaging and artificial intelligence (AI) at the edge. The announcement was made ahead of DSEI UK 2025, one of the world’s leading defense and security exhibitions, set to take place in London from September 9 to 12.
A Comprehensive Development Platform
The Boson+ IQ Development Kit brings together reference hardware and Prism™ software, giving system integrators a platform to create advanced edge AI capabilities. At its core is the Teledyne FLIR OEM AVP, powered by the Qualcomm® Dragonwing™ QCS8550 system-on-chip (SoC). The SoC delivers 50 trillion operations per second (TOPS) while drawing only 2.5 watts of power.
Its multicore architecture supports Prism AI object detection models and Prism ISP (Image Signal Processing) features, including denoising and super resolution. These capabilities ensure clear imaging in difficult environments, which is critical for defense, security, and industrial use.
“The Boson+ IQ Dev Kit represents a major leap forward for integrators building smarter, more efficient thermal systems at the edge with AI particularly for autonomy applications such as aerial drones, loitering munitions, and ground-based robotics,” said Jared Faraudo, vice president of product management and programs, Teledyne FLIR OEM. “By combining our high-performance Boson+ thermal camera with Prism AI and ISP software on a cutting-edge Qualcomm compute platform, we’re enabling faster development cycles, industry-best image quality, and longer mission endurance with minimal power consumption.”
Flexible and Scalable Design
The development kit was designed with scalability in mind. It includes interface and carrier boards with three MIPI interfaces, allowing developers to integrate visible or other sensor types alongside thermal cameras. To streamline development, the package also includes the Boson+ and Prism SDKs, hardware interface control documentation, and access to engineering support.
This design helps integrators move more efficiently from prototype to full deployment. The kit’s flexibility is expected to appeal to developers working across multiple sectors, from defense to industrial automation.
Future-Ready Capabilities
The Boson+ IQ Development Kit is compatible with upcoming software features such as Prism SKR and Prism Supervisor. Prism SKR will enable autonomous target detection and terminal guidance. Prism Supervisor will provide autonomous navigation to waypoints using GPS or visual-based navigation (VBN) technology.
These additions are expected to expand the kit’s potential for mission-critical applications, offering enhanced situational awareness and autonomy in complex environments.
Attendees at DSEI UK 2025 can see the Boson+ IQ Development Kit at the Teledyne FLIR stand (#S3-110) at ExCeL London. The exhibition runs September 9–12 and is recognized as one of the world’s premier defense and security events.
For more information, visit Teledyne FLIR OEM.
Read more:
- Teledyne FLIR OEM Supports Secure U.S. Defense Innovation with NDAA-Compliant Thermal Imaging
- Teledyne FLIR OEM Launches New Brand and Website to Support Secure US Innovation
- Teledyne FLIR OEM Ends Sales of SIRAS Drone
Miriam McNabb is the Editor-in-Chief of DRONELIFE and CEO of JobForDrones, a professional drone services marketplace, and a fascinated observer of the emerging drone industry and the regulatory environment for drones. Miriam has penned over 3,000 articles focused on the commercial drone space and is an international speaker and recognized figure in the industry. Miriam has a degree from the University of Chicago and over 20 years of experience in high tech sales and marketing for new technologies.
For drone industry consulting or writing, Email Miriam.
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