New kit combines hardware and software to accelerate AI integration for defense, security, and industrial applications Teledyne FLIR OEM has launched the Boson®+ IQ Development Kit, a new solution designed to speed up the integration of thermal imaging and artificial intelligence (AI) at the edge. The announcement was made ahead of DSEI UK 2025, one of the world’s leading … [Read more...] about Teledyne FLIR OEM Introduces Boson+ IQ Thermal Imaging Development Kit at DSEI UK 2025







